【公開日：2024.07.25】【最終更新日：2024.05.20】
課題データ / Project Data
課題番号 / Project Issue Number
23OS1019
利用課題名 / Title
誘導加熱使い低温半田付けの材料設計
利用した実施機関 / Support Institute
大阪大学 / Osaka Univ.
機関外・機関内の利用 / External or Internal Use
内部利用（ARIM事業参画者以外）/Internal Use (by non ARIM members)
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】（主 / Main）加工・デバイスプロセス/Nanofabrication（副 / Sub）計測・分析/Advanced Characterization
【重要技術領域 / Important Technology Area】（主 / Main）マルチマテリアル化技術・次世代高分子マテリアル/Multi-material technologies / Next-generation high-molecular materials（副 / Sub）-
キーワード / Keywords
電子顕微鏡/ Electronic microscope,スパッタリング/ Sputtering,膜加工・エッチング/ Film processing/etching,異種材料接着・接合技術/ Dissimilar material adhesion/bonding technology,溶接技術/ Welding technology
利用者と利用形態 / User and Support Type
利用者名（課題申請者）/ User Name (Project Applicant)
林 季玄
所属名 / Affiliation
大阪大学接合科学研究所 西川研
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
岩城 文
利用形態 / Support Type
（主 / Main）機器利用/Equipment Utilization（副 / Sub）,技術相談/Technical Consultation
利用した主な設備 / Equipment Used in This Project
OS-115：RFスパッタ成膜装置（絶縁体成膜用）
OS-126：接触式膜厚測定器
報告書データ / Report
概要（目的・用途・実施内容）/ Abstract (Aim, Use Applications and Contents)
This study evaluated a bonding process with low melting temperature Sn-Bi solder and induction heating that use unheating material substrate glass that sputter copper to realize minimal thermal impact on the joints.
実験 / Experimental
Use OS-115 RF sputter machine to sputter copper on the 10mmx10mmx0.1mm size glass substrate. To test the contact surface of glass and copper.
Use surface laser machine to see the sputter layer wettability with Sn-Bi solder. Then use thermal camera to test the heating temperature at induction heating process.
結果と考察 / Results and Discussion
Sputter copper have well contact with glass substrate, wetability is also well with Sn-Bi solder, thermal camera test result know tha sputter copper well effect to the inductiong heating process that make substrate temperature to rise, but will not affect the joint result, will not cause thermal damage.
図・表・数式 / Figures, Tables and Equations
図1 Induction heating glass substrate temperature observe by thermal camera
図2 Induction heating glass sputter copper substrate temperature observe by thermal camera
図3 Glass substrate sputter copper observe by SEM
図4 Glass substrate sputter copper observe by EDS Si elementelementelement
図5 Glass substrate sputter copper observe by EDS Cu elementelementelement
図6 Induction heating glass substrate sputter copper and Sn-Bi solder joint result observe by SEM
その他・特記事項（参考文献・謝辞等） / Remarks(References and Acknowledgements)
成果発表・成果利用 / Publication and Patents
論文・プロシーディング（DOIのあるもの） / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications：0件
特許登録件数 / Number of Registered Patents：0件