【公開日：2024.07.25】【最終更新日：2024.03.28】
課題データ / Project Data
課題番号 / Project Issue Number
23KT1198
利用課題名 / Title
Quartz結晶基板の切断
利用した実施機関 / Support Institute
京都大学 / Kyoto Univ.
機関外・機関内の利用 / External or Internal Use
内部利用（ARIM事業参画者以外）/Internal Use (by non ARIM members)
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】（主 / Main）加工・デバイスプロセス/Nanofabrication（副 / Sub）-
【重要技術領域 / Important Technology Area】（主 / Main）マルチマテリアル化技術・次世代高分子マテリアル/Multi-material technologies / Next-generation high-molecular materials（副 / Sub）量子・電子制御により革新的な機能を発現するマテリアル/Materials using quantum and electronic control to perform innovative functions
キーワード / Keywords
Quartz結晶基板,ダイシングーソー,Sr2RuO4,ダイシング/ Dicing,超伝導/ Superconductivity,異種材料接着・接合技術/ Dissimilar material adhesion/bonding technology
利用者と利用形態 / User and Support Type
利用者名（課題申請者）/ User Name (Project Applicant)
前野 悦輝
所属名 / Affiliation
京都大学 高等研究院 豊田理研-京大連携拠点 (TRiKUC)
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
ジョルダノ・マットニ (Giordano MATTONI)
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
大村英治
利用形態 / Support Type
（主 / Main）機器利用/Equipment Utilization（副 / Sub）,技術相談/Technical Consultation
利用した主な設備 / Equipment Used in This Project
報告書データ / Report
概要（目的・用途・実施内容）/ Abstract (Aim, Use Applications and Contents)
In our low-temperature experiments, we are using uniaxial pressure as a powerful tool to modify the properties of materials. For the unconventional superconductor Sr2RuO4, uniaxial pressure can be used to enhance the superconducting transition temperature from 1.5 to about 3.5K. Due to the brittle nature of oxide materials, it is desirable to glue the sample crystal on a substrate material to be used as mechanical support. We are developing a technique that involves using single-crystal quartz as substrate material, over which our sample Sr2RuO4 crystals are glued. To achieve homogeneous transfer of strain to the Sr2RuO4, it is necessary to slice single-crystal quartz with high precision in the desired size. Using the NanoHub facility, we diced quartz with a finer dicing blade and found out the importance of blade dressing to maintain clean cut quality.
実験 / Experimental
For our experiments, it is desirable to obtain quartz bars in the shape of 5mm x 0.3mm x 0.16mm. We previously diced single-crystal quartz wafers (13.95mm diameter, 0.16mm thickness) by using B1A and ZP07 blades at the NanoHub. While both blades successfully cut our substrate material, we found out that the edges of the cut quartz were progressively worsening after a few cuts. A possible cause of this fact is that during the cutting operation the dicing blade may pick up fragments of the hard quartz substrate, so that the blade surface may become “dirty” over time. To obviate this problem, we requested the help of Ohmura-san, who suggested us to perform “blade dressings” after every few cuts to clean the dicing blade.
結果と考察 / Results and Discussion
For our experiment, it is highly important to obtain quartz pieces with straight edges. Due to the high width-to-length ratio of the desired quartz slices, the material is prone to fracture upon dicing. We used a dicing blade B1A 1200, which has a finer grain than the B1A 400 that was used in the previous cutting rounds. We performed cuts at 0.55 and 0.5mm spacings, yielding quartz bars of 0.35 and 0.3mm in width, respectively. The first cuts of the quartz wafer were very clean and sharp, achieving the desired result. After about 8 cuts, however, significant chipping occurred (Fig. 1), where the edges of the cut quartz became irregular. We performed “blade dressing” by running 11 cuts on a special dressing board (Fig. 2) that has the power of removing fragments of cut material from the dicing blade. We then performed 8 new cuts on our quartz substrate and achieved clean cut edges. We determined that blade dressing should be performed after about 8 cuts of the quartz substrate in order to clean the blade and obtain sharp edges of the cut quartz pieces. We were satisfied with the results of this fabrication which yield quartz bars ideal for our strain experiments.
図・表・数式 / Figures, Tables and Equations
Fig.1: Diced single-crystal quartz wafer. Our goal is to obtain quartz bars of dimensions 5mm x 0.3mm x 0.16mm, with sharp diced edges. First the horizontal cuts were made from top to bottom; then, the vertical cuts were made from left to right. When using a brand-new dicing blade (B1A 12000), the first 8 cuts were clean and sharp, but the successive cuts showed rough edges (chipping), probably due to the blade picking up small fragments of the cut quartz. Blade dressing helped to clean the blade, allowing us to restore the blade quality and to obtain sharp cut quartz.
Fig.2: Special blade dressing board
その他・特記事項（参考文献・謝辞等） / Remarks(References and Acknowledgements)
成果発表・成果利用 / Publication and Patents
論文・プロシーディング（DOIのあるもの） / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications：0件
特許登録件数 / Number of Registered Patents：0件