【公開日：2024.07.25】【最終更新日：2024.06.29】
課題データ / Project Data
課題番号 / Project Issue Number
23UT0249
利用課題名 / Title
Thermal transport in an ultra-thin metal layer between non-metallic materials
利用した実施機関 / Support Institute
東京大学 / Tokyo Univ.
機関外・機関内の利用 / External or Internal Use
内部利用（ARIM事業参画者以外）/Internal Use (by non ARIM members)
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】（主 / Main）計測・分析/Advanced Characterization（副 / Sub）-
【重要技術領域 / Important Technology Area】（主 / Main）高度なデバイス機能の発現を可能とするマテリアル/Materials allowing high-level device functions to be performed（副 / Sub）次世代ナノスケールマテリアル/Next-generation nanoscale materials
キーワード / Keywords
Carbon related materials, Thin films, Surface and Interface,MEMS/NEMSデバイス/ MEMS/NEMS device,センサ/ Sensor,X線回折/ X-ray diffraction,ナノカーボン/ Nano carbon,ナノシート/ Nanosheet
利用者と利用形態 / User and Support Type
利用者名（課題申請者）/ User Name (Project Applicant)
Guo Rulei
所属名 / Affiliation
東京大学 大学院工学系研究科
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
Rulei Guo
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
Kazuhiro Fukawa,Keiko Isagai
利用形態 / Support Type
（主 / Main）機器利用/Equipment Utilization（副 / Sub）,技術補助/Technical Assistance
利用した主な設備 / Equipment Used in This Project
UT-202：高輝度In-plane型X線回折装置
UT-203：粉末X線回折装置
報告書データ / Report
概要（目的・用途・実施内容）/ Abstract (Aim, Use Applications and Contents)
The structure of a thin film metal layer between dielectric/semiconductor materials is common in semiconductor applications, such as 3D NAND flash devices, very large scale integrated circuits, graphene based gas sensors and so on[1]. Thermal management in those applications is critical for their performance, reliability, lifetime and energy consumption. So, it is necessary to investigate the thermal transport in this structure. As we all know, the predominant heat carrier in non-metallic materials is phonon, while it is electron in metallic materials. Hence, the electron-phonon coupling effect plays an important role for thermal transport across the interface between non-metallic materials and metallic materials. However, due to the measurement difficulty, the experimental investigation focusing on this important issue is absent[2,3]. In this work, we use multilayer graphene/ultra-thin metal layer/silicon substrate as an demonstration to investigate the thermal transport in an ultra-thin metal layer between non-metallic materials.
実験 / Experimental
We used the X-ray reflectivity method (SmartLab 9kw and SmartLab 3kw from Rigaku Co.) to measure the thicknesses of the metal layer.
We used the X-ray diffraction method (SmartLab 9kw and SmartLab 3kw from Rigaku Co.) to characterise the crystallinity of the metal layer.
結果と考察 / Results and Discussion
Figure 1 shows the thickness measurement of the metal layer (platinum) by X-ray reflectivity (XRR). For all the samples, there is a layer of titanium with a thickness of around 1 nm as an adhesive layer. And the thickness of the platinum layer is in the range of 1 nm to 18 nm.
Figure 2 shows the crystallinity measurement of the metal layer (gold) by X-ray diffraction (XRD). There are two peaks which correspond to the (1 1 1) and (2 2 2) peak of gold. Hence, the crystal orientation of gold film is (1 1 1). The sharp peak suggests that the gold layer has a high crystallinity.
図・表・数式 / Figures, Tables and Equations
Fig. 1, The thickness of metal layer (Platinum) measured by X-Ray Reflectivity (XRR)
Fig. 2, the crystallinity of metal layer (Gold) measured by X-Ray Diffraction (XRD)
その他・特記事項（参考文献・謝辞等） / Remarks(References and Acknowledgements)
[1] Yokoyama, Takamune, et al. "Pd-functionalized, suspended graphene nanosheet for fast, low-energy multimolecular sensors." ACS Applied Nano Materials 1.8 (2018): 3886-3894.
[2] Koh, Yee Rui, et al. "Thermal boundary conductance across epitaxial metal/sapphire interfaces." Physical Review B 102.20 (2020): 205304.[3] Ordonez-Miranda, Jose, J. J. Alvarado-Gil, and Ronggui Yang. "The effect of the electron-phonon coupling on the effective thermal conductivity of metal-nonmetal multilayers." Journal of Applied Physics 109.9 (2011).
成果発表・成果利用 / Publication and Patents
論文・プロシーディング（DOIのあるもの） / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications：0件
特許登録件数 / Number of Registered Patents：0件