【公開日:2023.07.31】【最終更新日:2023.05.23】
課題データ / Project Data
課題番号 / Project Issue Number
22UT1139
利用課題名 / Title
Optical properties of air-suspended 1D-2D heterostructure
利用した実施機関 / Support Institute
東京大学 / Tokyo Univ.
機関外・機関内の利用 / External or Internal Use
外部利用/External Use
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】(主 / Main)加工・デバイスプロセス/Nanofabrication(副 / Sub)-
【重要技術領域 / Important Technology Area】(主 / Main)次世代ナノスケールマテリアル/Next-generation nanoscale materials(副 / Sub)-
キーワード / Keywords
膜加工・エッチング/Film processing and Etching,EB,ナノチューブ/ Nanotube
利用者と利用形態 / User and Support Type
利用者名(課題申請者)/ User Name (Project Applicant)
加藤 雄一郎
所属名 / Affiliation
理化学研究所
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
Yih-Ren Chang,Nan Fang,Chee Fai Fong,Wataru Terashima
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
利用形態 / Support Type
(主 / Main)機器利用/Equipment Utilization(副 / Sub)-
利用した主な設備 / Equipment Used in This Project
UT-503:超高速大面積電子線描画装置
UT-604:高速シリコン深掘りエッチング装置
UT-900:ステルスダイサー
報告書データ / Report
概要(目的・用途・実施内容)/ Abstract (Aim, Use Applications and Contents)
We use the apparatus to create trenches on silica substrates for suspended carbon nanotube (CNT) growth.
The suspended CNT will be applied to 1D-2D heterostructure formation.
実験 / Experimental
EB lithography was applied to define trench patterns. Trenches on silicon oxide substrate is created by inductively coupled plasma etching. Second EB lithography was applied to define the deposition patterns of metal catalyst. After metal catalyst deposition, CNTs are grown by a CVD method. Finally, 2D materials are transferred on CNT to form 1D-2D heterostructure.
結果と考察 / Results and Discussion
The trenches and patterns for catalyst deposition are clearly defined and created, which contribute to the CVD growth of CNTs. The 1D-2D heterostructures were fabricated by 2D material transfer, as shown in Figure 1. Futher characterization of these 1D-2D heterostructures will be conducted through optical approaches.
図・表・数式 / Figures, Tables and Equations
Figure 1. OM image of 2D material transferred on trench.
その他・特記事項(参考文献・謝辞等) / Remarks(References and Acknowledgements)
The main user of this report, Yih-Ren Chnag, is supported by postdoctoral fellowship of JSPS.
成果発表・成果利用 / Publication and Patents
論文・プロシーディング(DOIのあるもの) / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications:0件
特許登録件数 / Number of Registered Patents:0件