【公開日：2023.07.31】【最終更新日：2023.05.15】
課題データ / Project Data
課題番号 / Project Issue Number
22UT0430
利用課題名 / Title
SEM EDX of NbC after ECM
利用した実施機関 / Support Institute
東京大学
機関外・機関内の利用 / External or Internal Use
内部利用（ARIM事業参画者以外）/Internal Use (by non ARIM members)
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】（主 / Main）計測・分析/Advanced Characterization（副 / Sub）-
【重要技術領域 / Important Technology Area】（主 / Main）その他/Others（副 / Sub）-
キーワード / Keywords
NbC, ECM, SEM-EDX,電子顕微鏡/Electron microscopy,電子分光
利用者と利用形態 / User and Support Type
利用者名（課題申請者）/ User Name (Project Applicant)
Saxena Krishna
所属名 / Affiliation
東京大学
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
利用形態 / Support Type
（主 / Main）機器利用/Equipment Utilization（副 / Sub）-
利用した主な設備 / Equipment Used in This Project
報告書データ / Report
概要（目的・用途・実施内容）/ Abstract (Aim, Use Applications and Contents)
The aim of this research was to study the machining characteristics of Niobium Carbide (NbC) cermet with Nickel (Ni) binder during the electrochemical machining process (ECM). The goal was to find out which material dissolves first during the ECM process while using a neutral aqueous sodium nitrate electrolyte.
実験 / Experimental
The experiments were conducted using an electrochemical machining process with 30 V voltage, 50us pulse on time, and a 50% duty cycle. The samples were prepared by polishing. The goal here was to evaluate as which element dissolves first during the ECM of NbC. To evaluate this, samples were machined at different numbers of pulses i.e 10 pulses and 100 pulses. The elemental analysis was conducted using SEM and EDX.
結果と考察 / Results and Discussion
The electrochemically machined surfaces of NbC cermet were analysed with SEM and EDX (line-EDX). The surfaces showed the presence of electrochemical machining footprints with preferential dissolution of Ni binder (as observed from line-EDX). Further result analysis is under process.
図・表・数式 / Figures, Tables and Equations
その他・特記事項（参考文献・謝辞等） / Remarks(References and Acknowledgements)
成果発表・成果利用 / Publication and Patents
論文・プロシーディング（DOIのあるもの） / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications：0件
特許登録件数 / Number of Registered Patents：0件