【公開日：2023.07.31】【最終更新日：2023.05.23】
課題データ / Project Data
課題番号 / Project Issue Number
22UT0071
利用課題名 / Title
Characterization of DLC Films Deposited on Plasma Nitrided Stainless steel
利用した実施機関 / Support Institute
東京大学 / Tokyo Univ.
機関外・機関内の利用 / External or Internal Use
内部利用（ARIM事業参画者以外）/Internal Use (by non ARIM members)
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】（主 / Main）計測・分析/Advanced Characterization（副 / Sub）-
【重要技術領域 / Important Technology Area】（主 / Main）その他/Others（副 / Sub）-
キーワード / Keywords
DLC, Plasma Nitrided Stainless,電子顕微鏡/Electron microscopy
利用者と利用形態 / User and Support Type
利用者名（課題申請者）/ User Name (Project Applicant)
Abdelrahman Mohamed Farghali Abdelati
所属名 / Affiliation
東京大学
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
利用形態 / Support Type
（主 / Main）機器利用/Equipment Utilization（副 / Sub）-
利用した主な設備 / Equipment Used in This Project
報告書データ / Report
概要（目的・用途・実施内容）/ Abstract (Aim, Use Applications and Contents)
Depositing DLC film on metallic substrates is often hindered by its poor adhesion caused by different thermal expansion coefficients of both steel and DLC film which drives total delamination. In order to solve this problem, various types of interlayers (Si, Mo, W, CrN, and TiN) have been tested.
実験 / Experimental
The samples were cut and polished until a mirror like surface is obtained in the cross section. All samples were analyzed and observed by Raman spectroscopy, scanning electron microscope (SEM), and energy dispersive spectroscopy (EDS).
結果と考察 / Results and Discussion
The thickness of DLC coating is 2.4 μm and a SiCx:H interlayer has a thickness of 0.5 μm. The bare nitrided AISI420J2 substrate is also shown. The nitrided layer thickness is 30 μm with different morphologies than the original substrate material.
図・表・数式 / Figures, Tables and Equations
その他・特記事項（参考文献・謝辞等） / Remarks(References and Acknowledgements)
成果発表・成果利用 / Publication and Patents
論文・プロシーディング（DOIのあるもの） / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications：0件
特許登録件数 / Number of Registered Patents：0件