<拡大>
 

イベント詳細情報

印刷
件名【IITC 2018】IEEE International Interconnect Technology Conference
開始日時2018/06/04 17:00
終了日時2018/06/08 17:00
場所Marriott Santa Clara, CA, USA
連絡先melissaw(at)widerkehr.com
詳細 IEEE International Interconnect Technology Conference (IITC 2018) covers topics such as :

 APPLICATION OF INTEREST
-Advanced interconnect metallization with low-k dielectrics
-Optical, wireless, and carbon-based interconnects, beyond Cu interconnects
-Contacts to MOS devices: Silicide, III-V, 2D materials
-Interconnects and BEOL elements for Memory: 3D NAND, CBRAM, PCRAM, ReRAM, MRAM, DRAM
-3D integration & packaging: WtW/CtW bonding, Interposer, Through Si Via, CPI
-Novel System and Emerging Technology: Energy harvesting, brain inspired computing
-Novel Form Factors: Flexible electronics, wearables

 TOPICS OF INTEREST
-Process integration, advanced patterning for MOL/BEOL
-Materials and Unit Processes (Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, selective deposition)
-Reliability and Failure analysis, techniques and methods
-Advanced material/process characterization, design-technology co-optimization, modelling

Sponsor : IEEE Electron Devices Society

Early Registration Deadline :
May 13, 2018

Registration Deadline : May 25, 2018

Please go to the following URL for more information.
URL : 
http://www.iitc-conference.org
https://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=42731