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件名【EDTM 2017】IEEE Electron Devices Technology and Manufacturing Conference
開始日時2017/02/28 00:00
終了日時2017/03/03 00:00
場所Toyama International Conference Center, Toyama, Japan
連絡先edtm(at)jtbcom.co.jp
詳細 Deep-dive discussions among industry experts on materials, processes and devices are essential to accelerate manufacturing innovations. The first conference in 2017 focuses on devices, tools, materials for IoT. Packaging and Manufacturing Technology are also discussed.

Topics for EDTM 2017:
・Devices and Manufacturing for "Cloud and Edge"
・Packaging and Manufacturing for "Cloud and Edge"
・Process, Tools, and Manufacturing
・Materials
・Reliability & Modeling

Extended abstract submission deadline: November 4 (JST), 2016

Please go to the following URL for more information.
URL:
http://ewh.ieee.org/conf/edtm/2017/
https://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=40312